Abstract: Wafer-level power devices, including thyristors, and their derivatives, such as integrated gate-commutated thyristors (IGCTs), demand a higher performance by the electrical transmission ...
Abstract: 3D integration by adopting wafer-to-wafer (W2W) or chip-to-wafer (C2W) direct bonding techniques scales up interconnect density. Heterogenous integration enabled by direct bonding technology ...
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