The Nature Index 2025 Research Leaders — previously known as Annual Tables — reveal the leading institutions and countries/territories in the natural and health sciences, according to their output in ...

OSAKA, Japan--(BUSINESS WIRE)--Panasonic Corporation today announced that it developed a semiconductor encapsulation material for power devices that boasts the industry's top-class *1 heat-resistance ...

Researchers from Tsinghua University Press have elucidated how CrTaO 4 enhances the oxidation resistance of high-entropy alloys containing chromium and tantalum. They suggest that CrTaO4 holds ...

The research explores the development of SiC f /SiC composites for high-temperature, radiation, and corrosion-resistant applications, focusing on advanced preparation process and the integration of AI ...

According to the research team, a wide variety of these alloys are showing great promise on a number of metrics; strength-to-weight, fracture toughness, corrosion and radiation resistance, wear ...

CLEVELAND--(BUSINESS WIRE)--Sherwin-Williams introduces the next generation of CUI coatings to the oil and gas industry, Heat-Flex Hi-Temp 1200, an immersion-grade single-component inert ...

Carbon fiber-reinforced ultra-high-temperature ceramic (UHTC) matrix composites are extensively used in space shuttles and high-speed vehicles. However, these composites suffer from a lack of ...

As discussed in chapters 2 and 3, most hot structures are fabricated from superalloys that have been tailored to meet the demands of turbine engine operation. Specific solutions to problems ...

Riedon's advanced CHR and HVS chip resistor technology delivers high-performance, high-temperature operation with resistance values up to 10Tohms. The maximum continuous working temperature of ...

Creeps are characterized as time-dependent permanent deformations that occur under constant stress at elevated temperatures. The material composition determines the onset of creep. For example, steel ...

From the last several lithography nodes, in the 14 to 10nm range, to the latest nodes, in the 7 to 5nm range, the requirements for patterning and image transfer materials have increased dramatically.