EDN

Finally, CSP Packages for Leaded Devices

CSP, driven by end-customer demand for portable handheld products, is exploding in use across the IC packaging industry. But the most utilized CSP package style emerging for 8-64 lead-count devices is ...
Design-Reuse

Oki Semiconductor offers a unique high performance, and fully qualified miniature W-CSP Package for low power SoC ASIC Designs

Innovative chip package and small footprint is ideal for small mobile applications Sunnyvale, Calif., March 8, 2004 — Oki Semiconductor, a leading technology partner for the new era of digital ...
Digi Times

IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend service capacities ...
EDN

ChipPAC rolls out lead-free CSP package for mobile products

FREMONT, Calif. — ChipPAC Inc. here today announced that it has developed a high-density, lead-free chip-scale package (CSP) for mobile applications. Geared for handheld consumer applications, the ...