CSP, driven by end-customer demand for portable handheld products, is exploding in use across the IC packaging industry. But the most utilized CSP package style emerging for 8-64 lead-count devices is ...
Innovative chip package and small footprint is ideal for small mobile applications Sunnyvale, Calif., March 8, 2004 — Oki Semiconductor, a leading technology partner for the new era of digital ...
Taiwan-based IC substrate makers Unimicron Technology, Kinsus Interconnect Technology and Nanya PCB will continue to ramp up their production capacities for flip-chip chip scale package (FC CSP) ...
As IC speeds continue to climb well into the gigahertz range, system designers are finding that the new obstacles they must overcome to interconnect ICs to packages and packages to printed-circuit ...
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend service capacities ...
Combined, laminate substrates and leadframes will represent an estimated US$ 13.3 billion market in 2011 and is forecasted to reach $14 billion in 2012. This is larger than the revenues for silicon ...
Much has changed in IC packaging technology since the first real-time microfocus X-ray systems entered the inspection market nearly 20 years ago. The trend for high-density packaging is moving from ...
Texas Instruments TPS61050 IC is based on a high-frequency synchronous-boost topology with constant current sink to drive single, high-brightness white light emitting diodes. Texas Instruments' ...
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